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Application of Chords for Quantitative Characterization of Multi-Constituent Microstructures

✍ Scribed by Shenjia Zhang; Kip O. Findley

Book ID
113111520
Publisher
Springer-Verlag
Year
2012
Tongue
English
Weight
495 KB
Volume
1
Category
Article
ISSN
2192-9262

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A~tract--Preliminary results on the feasibility of using co-evaporation of eutectic Au/Sn solder for semiconductor packaging are presented. Gold is electron beam evaporated, while Sn is thermally evaporated, onto Ti/Pt/Au metallized InP substrates. Electron microscopy is utilized to determine the co