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Anti-sticking treatment for a nanoimprint stamp

✍ Scribed by Hongwen Sun; Jingquan Liu; Pan Gu; Di Chen


Book ID
104002227
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
650 KB
Volume
254
Category
Article
ISSN
0169-4332

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✦ Synopsis


Nanoimprint lithography (NIL), as a low-cost and mass production technique, has played an important role in micro/nano fabrication. However, the sticking problem between the stamp and resist blocks its further application. In order to modify the contact surface, a molecular dynamics (MD) method was used to choose the proper material to coat on the surface of the stamp. According to the MD analysis, CF 2 was found to be a good choice for this purpose. It was applied to the nanoimprint stamp by using the gases in reactive ion etching (RIE). A self-assembly monolayer (SAM) layer was also used in the experiment to release the contact surface energy. Both dry and wet methods were demonstrated as excellent anti-sticking approaches by measuring the contact angles and calculating the surface energy. Both the stamps after anti-sticking treatment can be used more times than the untreated stamps.


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In nanoimprint lithography, the most common approach to prevent resist to adhere to the mold is to graft a fluorinated anti-sticking layer on the mold's surface. But it is known that these layers suffer from degradation after a certain number of imprints. In this work, we study the influence of the