In nanoimprint lithography, the most common approach to prevent resist to adhere to the mold is to graft a fluorinated anti-sticking layer on the mold's surface. But it is known that these layers suffer from degradation after a certain number of imprints. In this work, we study the influence of the
Anti-sticking treatment for a nanoimprint stamp
β Scribed by Hongwen Sun; Jingquan Liu; Pan Gu; Di Chen
- Book ID
- 104002227
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 650 KB
- Volume
- 254
- Category
- Article
- ISSN
- 0169-4332
No coin nor oath required. For personal study only.
β¦ Synopsis
Nanoimprint lithography (NIL), as a low-cost and mass production technique, has played an important role in micro/nano fabrication. However, the sticking problem between the stamp and resist blocks its further application. In order to modify the contact surface, a molecular dynamics (MD) method was used to choose the proper material to coat on the surface of the stamp. According to the MD analysis, CF 2 was found to be a good choice for this purpose. It was applied to the nanoimprint stamp by using the gases in reactive ion etching (RIE). A self-assembly monolayer (SAM) layer was also used in the experiment to release the contact surface energy. Both dry and wet methods were demonstrated as excellent anti-sticking approaches by measuring the contact angles and calculating the surface energy. Both the stamps after anti-sticking treatment can be used more times than the untreated stamps.
π SIMILAR VOLUMES