Annealing Behaviour of Deuterium in Silicon Doped Carbon Films
β Scribed by J. Likonen; E. Vainonen-Ahlgren; T. Ahlgren; S. Lehto; T. Sajavaara; W. Rydman; J. Keinonen; J. Katainen; C.H. Wu
- Publisher
- John Wiley and Sons
- Year
- 2002
- Tongue
- English
- Weight
- 132 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0005-8025
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β¦ Synopsis
Annealing behaviour of deuterium in carbon films with different Si contents deposited by a pulsed arc discharge method in deuterium atmosphere was studied. The concentration profiles of D were measured by secondary ion mass spectrometry and elastic recoil detection techniques. A model taking into account diffusion, detrapping and trapping of D is used to describe the experimental depth profiles. Diffusion coefficients obtained for non-trapped D resulted in activation energies of 1.5 Β± 0.2, 0.7 Β± 0.2, 0.6 Β± 0.2 and 1.2 Β± 0.2 eV for samples containing 0, 6, 15 and 33 at.% of Si, respectively.
π SIMILAR VOLUMES
## Abstract The erosion behaviour of doped carbon materials was investigated in deuterium low pressure discharges. Therefore, amorphous carbon films on silicon substrates (film thickness βΌ1 ΞΌm) with varying dopant species (V, Ti andW), dopant concentration (between 1 at% and 8.5 at%) and dopant dis