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Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity

✍ Scribed by Barmak, K.; Gungor, A.; Cabral, C.; Harper, J. M. E.

Book ID
126896944
Publisher
American Institute of Physics
Year
2003
Tongue
English
Weight
717 KB
Volume
94
Category
Article
ISSN
0021-8979

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πŸ“œ SIMILAR VOLUMES

Effect of annealing on the resistivity o
Effect of annealing on the resistivity of quench-condensed Cu and Cu(Fe) thin films
✍ P. J. SilvΔ—rman; C. V. Briscoe πŸ“‚ Article πŸ“… 1978 πŸ› Springer US 🌐 English βš– 295 KB

Pure Cu and Cu(Fe) thin films containing ~0.1 and ~1.0 at % Fe were prepared by low-temperature deposition onto a liquid-helium-cooled substrate. The Cu (Fe ) films were annealed sequentially at approximately 17, 70, and 270 K. After each annealing stage the resistivity was measured down to ~l.5 K.