Analysis of thermomechanical interactions in a miniature solder system under cyclic fatigue loading
β Scribed by Bor Zen Hong
- Book ID
- 107457989
- Publisher
- Springer US
- Year
- 1999
- Tongue
- English
- Weight
- 371 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0361-5235
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π SIMILAR VOLUMES
This paper is concerned with the elastic plastic response of a two-bar system with temperature-dependent elastic coefficients under cyclic thermomechanical loadings. Such materials are characterized by lack of results concerning the asymptotic behaviors and conditions for shakedown occurrence. This
A layer-wise strength analysis of laminates leads to realistic results not only with quasistatic but also with cyclic loading. The used fatigue strength has to be determined by experiment. Degradation models exist, used to reduce the laminate stiffness due to inter-fibre fracture (IFF) cracks. Howev