𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Analysis of the creep response of an Al–17Si–4Cu–0.55Mg alloy

✍ Scribed by S. Spigarelli; E. Evangelista; S. Cucchieri


Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
162 KB
Volume
387-389
Category
Article
ISSN
0921-5093

No coin nor oath required. For personal study only.

✦ Synopsis


The creep response of a hypereutectic Al-Si alloy containing 4% Cu and 0.55% Mg was investigated between 553 and 653 K. Minimum creep rate as a function of applied stress by using the power-law equation suggested the existence of two different regimes: a low-stress regime characterised by a stress exponent close to 4-5, and a high-stress regime with a higher stress exponent. Although the magnitude of the stress exponent in the low-stress regime was equivalent to that observed in pure Al, the apparent activation energy for creep was higher (Q = 210 kJ/mol) than the activation energy for self-diffusion in Al (Q d = 143 kJ/mol). The microstructural analysis suggested a similarity between this alloy and Al-matrix discontinuously reinforced composites. This approach, based on threshold-stress concept, permitted to rationalise both the magnitude of the stress exponent and the apparent activation energy for creep. In addition, the substantial similarity between hypereutectic Al-Si alloys and Al-based composites with similar composition was confirmed.


📜 SIMILAR VOLUMES


Creep behavior of fine grained Cu-2.8 Al
✍ A. Arieli; T. Kainuma; A.K. Mukherjee 📂 Article 📅 1982 🏛 Elsevier Science ⚖ 919 KB

The elevated temperature creep properties of a fine grained copper alloy (CDA 638) was investigated between 673 and 798 K at strain rates ranging from lo-' s-' to 2 x lo-\* s-'. The mechanical data were analyzed in order to establish the stress, temperature, and grain size dependence of the strain r