Analysis of package cracking during reflow soldering process : Makoto Kitano, Asao Nishimura, Sueo Kawai and Kunihiko Nishi. Proc. IEEE/IRPS, 90 (1988)

• Book ID: 103285748
• Publisher: Elsevier Science
• Year: 1989
• Tongue: English
• Weight: 128 KB
• Volume: 29
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(89)90264-3