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Analysis of low-temperature intermetallic growth in copper-tin diffusion couples

✍ Scribed by Mei, Z. ;Sunwoo, A. J. ;Morris, J. W.

Book ID: 112823847
Publisher: The Minerals, Metals & Materials Society
Year: 1992
Tongue: English
Weight: 743 KB
Volume: 23
Category: Article
ISSN: 1543-1916
DOI: 10.1007/bf02675563

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