XPS Study of the Oxidation Behavior of t
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Wang, DongNing; Miller, Alfred C.; Notis, Michael R.
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Article
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1996
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John Wiley and Sons
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English
β 383 KB
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The oxidation of Cu-Sn intermetallic compounds is of significant technological interest in relation to the wetting behavior of Sn-base solders to Cu and Cu alloys. However, there are very few studies on this subject in the literature. In this present study, oxide films formed on the intermetallic co