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An SPC artifact for automated solder joint inspection

✍ Scribed by Ted Doiron; David A. Pinsky; Sullivan Chen; Michael Plott

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 417 KB
Volume: 12
Category: Article
ISSN: 0263-2241
DOI: 10.1016/0263-2241(93)90031-c

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