An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

✍ Scribed by Chang, D.D.; Crawford, P.A.; Fulton, J.A.; Mcbride, R.; Schmidt, M.B.; Sinitski, R.E.; Wong, C.P.

• Book ID: 114560500
• Publisher: IEEE
• Year: 1993
• Tongue: English
• Weight: 908 KB
• Volume: 16
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.273681