A method to measure transient heat transfer to liquid helium from a thin metal film heater under the condition of pulsed heating during r < 400 ns is proposed. The experimental equipment used for the measurements is described. The method is based on the comparison of heat pulses transfered from the
An investigation of heat transfer from thin cylinders to liquid helium 1
โ Scribed by I.N. Goncharov; H.S. Su; F. Chovanec
- Publisher
- Elsevier Science
- Year
- 1970
- Tongue
- English
- Weight
- 199 KB
- Volume
- 10
- Category
- Article
- ISSN
- 0011-2275
No coin nor oath required. For personal study only.
โฆ Synopsis
The results of an investigation of the dependence of heat flux on the temperature jump occurring at the boundary between a thin cylinder and liquid hefium are presented. These measurements were made with 0.05--0.5 mm diameter manganin wires at temperatures of 2.2-4.2 K. It is shown that the maximum value of the heat flux for nucleate boifing has a small temperature dependence at 4.2-3 K, and then this value decreases by a factor of almost two if the temperature falls down to T, while the temperature jump increases. It was found that the lower the cylinder diameter, the higher the maximum heat flux and temperature jump.
๐ SIMILAR VOLUMES
The temperature rise due to a step-wise pulse current/heat through horizontally immersed thin wires in a bath of sub-cooled superfluid helium (HelIp) is studied. Simplifications are made to establish the mathematical model according to the transient heat transfer characteristics of Hellp. The comput
## Abstract This paper presents a series of experimental results on a passive augmentation technique of boiling heat transfer by supplying solid particles in liquid. A cylindrical heater 0.88 mm in diameter is placed in saturated water, in which a lot of mobile particles exist, and the nucleate and
Heat transfer characteristics of a copper plate (18 mm x 76 mm) to liquid helium have been measured by changing the orientation and treatment of the heat transfer surface. The treated heat transfer surfaces were (a) the polished Cu surface, (b) the oxidized Cu surface and (cl, (d) the Cu surface oxi