An integrated multi-objective immune algorithm for optimizing the wire bonding process of integrated circuits

✍ Scribed by Tung-Hsu Hou; Chi-Hung Su; Hung-Zhi Chang

• Book ID: 106387673
• Publisher: Springer US
• Year: 2008
• Tongue: English
• Weight: 788 KB
• Volume: 19
• Category: Article
• ISSN: 0956-5515
• DOI: 10.1007/s10845-008-0088-2