✦ LIBER ✦
An integrated system for setting the optimal parameters in IC chip-package wire bonding processes
✍ Scribed by Tung-Hsu Hou; Shyh-Huei Chen; Tzu-Yu Lin; Kun-Ming Huang
- Publisher
- Springer
- Year
- 2005
- Tongue
- English
- Weight
- 172 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0268-3768
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