An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments

✍ Scribed by Hayashi, T.

• Book ID: 114560314
• Publisher: IEEE
• Year: 1992
• Tongue: English
• Weight: 578 KB
• Volume: 15
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.142898