An electromigration failure model for interconnects under pulsed and bidirectional current stressing

✍ Scribed by Jiang Tao; Cheung, N.W.; Chenming Hu

• Book ID: 114535667
• Publisher: IEEE
• Year: 1994
• Tongue: English
• Weight: 621 KB
• Volume: 41
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/16.278507