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An electrochemical AFM study on electrodeposition of copper on p-GaAs(100) surface in HCl solution

✍ Scribed by M. Koinuma; K. Uosaki


Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
756 KB
Volume
40
Category
Article
ISSN
0013-4686

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✦ Synopsis


In

situ atomic force microscopy (AFM) was used to observe the surface structure change during electrodeposition of Cu on p-GaAs(100) surface in HCI solution. How the electrodeposition of Cu proceeded was strongly dependent on the structure of the substrate. In the portion where the surface was relatively smooth, Cu tended to deposit first, forming randomly distributed Cu clusters followed by the three dimensional growth of the clusters. On the other hand, when the surface already had some structure, Cu deposited along the structure of the substrate.


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