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An Accurate Transient Analysis of High-Speed Package Interconnects Using Convolution Technique

✍ Scribed by Wendemagegnehu T. Beyene; Chuck Yuan

Book ID: 111539787
Publisher: Springer
Year: 2003
Tongue: English
Weight: 539 KB
Volume: 35
Category: Article
ISSN: 0925-1030
DOI: 10.1023/a:1024170314125

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