✦ LIBER ✦
Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator : MARK S. BASEL, MICHAEL B. STEER and PAUL D. FRANZON. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18(1), 74 (February 1995)
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 114 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
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