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[American Vacuum Soc 1998 3rd International Symposium on Plasma Process-Induced Damage - Honolulu, HI, USA (4-5 June 1998)] 1998 3rd International Symposium on Plasma Process-Induced Damage (Cat. No.98EX100) - Backside films and charging during via etch in LOCOS and STI technologies

✍ Scribed by Hook, T.B.

Book ID: 126612708
Publisher: American Vacuum Soc
Year: 1998
Weight: 394 KB
Category: Article
ISBN-13: 9780965157728
DOI: 10.1109/PPID.1998.725562

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