𝔖 Bobbio Scriptorium
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Alloy gold deposits for electronic applications

✍ Scribed by W. A. Fairweather

Publisher
World Gold Council
Year
1977
Tongue
English
Weight
864 KB
Volume
10
Category
Article
ISSN
0017-1557

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## Abstract A new method is described for bonding gold to Teflon FEP, yielding high joint strength without affecting the electrical properties of the virgin polymer material. The method consists of depositing a 1000‐Å aluminum layer onto the Teflon by evaporation, removing it by washing the sample