The rate and effects of isothermal physical aging of a fully cured epoxyamine/glass fiber composite specimen were studied for a wide range of isothermal aging temperatures (0180 to 200ΠC) using a freely oscillating torsion pendulum technique: torsional braid analysis (TBA). As assigned from the maxi
Aging behavior of a hot-cured epoxy system
β Scribed by Davis Fata; Wulff Possart
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 146 KB
- Volume
- 99
- Category
- Article
- ISSN
- 0021-8995
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β¦ Synopsis
Abstract
The thermal and hydroβthermal aging of a hotβcured epoxy system (diglycidylether of bisphenol A (DGEBA) + dicyandiamide (DDA)) in the glassy state is revisited using DSC and IR attenuated total reflection spectroscopy. Because of the diffusion of DDA from the solid particles into the liquid DGEBA matrix, curing produces a highly crosslinked amorphous matrix that contains low crosslinked amorphous regions. After full curing, the network possesses a relatively low molecular mobility and no residual reactive groups. Thermal and hydroβthermal loading is performed at 60Β°C, well below the principal glass transition temperature (T~__g__1~ = 171Β°C). Both aging regimes cause significant chemical and structural changes to the glassy epoxy. It undergoes a phase separation of relatively mobile segments inside the low mobile matrix, providing a second glass transition that shifts from T~__g__2~ = 86β114Β°C within 108 days of aging. This phase separation is reversible on heating into the viscoelastic state. Hydroβthermal aging leads to a reversible and a nonreversible plasticizing effect as well. On thermal aging, no chemical changes are observed but hydroβthermal aging causes significant chemical modifications in the epoxy system. These modifications are identified as a partial degradation of crosslinks produced by the cyano groups of the DDA and correspond to the nonreversible plasticitation. These changes in the cured epoxy should exert an influence on the mechanical properties of an adhesive bond. Β© 2005 Wiley Periodicals, Inc. J Appl Polym Sci, 2006
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