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Advanced metrology for rapid characterization of the thermal mechanical properties of low-k dielectric and copper thin films

✍ Scribed by S. H. Lau; Ellie Tolentino; Yuen Lim; Evangeline Tolentino; Ann Koo

Publisher: Springer US
Year: 2001
Tongue: English
Weight: 788 KB
Volume: 30
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-001-0034-y

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