Advanced Metallization and Interconnect Systems for Ulsi Applications in 1997
โ Scribed by R. Cheung, J. Klein, K. Tsubouchi, M. Murakami, N. Kobayashi
- Publisher
- Materials Research Society
- Year
- 1999
- Tongue
- English
- Leaves
- 697
- Series
- Materials Research Society
- Category
- Library
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
<p><P><STRONG>Advanced Nanoscale ULSI Interconnects: Fundamental and Applications</STRONG> brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip,
<p>This book provides comprehensive coverage of the recent advances in symbolic analysis techniques for design automation of nanometer VLSI systems. The presentation is organized in parts of fundamentals, basic implementation methods and applications for VLSI design. Topics emphasized include statis