✦ LIBER ✦

Advanced IC packaging for the future applications

✍ Scribed by Anjoh, I.; Nishimura, A.; Eguchi, S.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Polyimidesiloxanes: Emerging materials f

✍ Chung J. Lee 📂 Article 📅 1989 🏛 Springer US 🌐 English ⚖ 604 KB

Advanced CMOS technology portfolio for R

✍ Chih-Sheng Chang; Chih-Ping Chao; Chern, J.G.J.; Sun, J.Y.-C. 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 782 KB

Packaging for the future

✍ RAY WHITE 📂 Article 📅 1994 🏛 John Wiley and Sons 🌐 English ⚖ 430 KB

C-SAM sounds the warning for IC packagin

✍ Yalamanchili, P.; Christou, A.; Martell, S.; Rust, C. 📂 Article 📅 1994 🏛 IEEE 🌐 English ⚖ 548 KB

Advances in controlled release devices f

✍ Marcella Mastromatteo; Marianna Mastromatteo; Amalia Conte; Matteo Alessandro De 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 528 KB

Applications of advanced composites for

✍ John Glatz; D.L. Vrable 📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 704 KB