Advanced encapsulant systems for flip-chip-on-board assemblies: underfills with improved manufacturing properties

✍ Scribed by Gamota, D.R.; Melton, C.M.

• Book ID: 114560660
• Publisher: IEEE
• Year: 1998
• Weight: 149 KB
• Volume: 21
• Category: Article
• ISSN: 1083-4400
• DOI: 10.1109/3476.720417