๐”– Bobbio Scriptorium
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ADVANCE and glycaemia thresholds: a need to clarify the statistical approach

โœ Scribed by Currie, C. J.

Book ID
113017856
Publisher
Springer
Year
2012
Tongue
English
Weight
65 KB
Volume
55
Category
Article
ISSN
0012-186X

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## Abstract This paper presents some dominant parameters ruling thermal stress in each bump between a chip and a substrate when they are heated. Reducing the thermal stress in bumps between a chip and a substrate is one of the most effective methods to make the joints resistant to thermal fatigue.