A theoretical approach to clarify the dominant parameters governing thermal stress in chip device joints
✍ Scribed by Tetsuya Akiyama
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 227 KB
- Volume
- 84
- Category
- Article
- ISSN
- 1042-0967
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✦ Synopsis
Abstract
This paper presents some dominant parameters ruling thermal stress in each bump between a chip and a substrate when they are heated. Reducing the thermal stress in bumps between a chip and a substrate is one of the most effective methods to make the joints resistant to thermal fatigue. In this report, three dominant parameters are introduced via a simple numerical model. Next, the effects of each parameter on thermal stress are discussed. Lastly, a method is proposed that strengthens the joint between a chip and a substrate against thermal cycle. This method cannot reduce the thermal stress just after brazing but reduces the cyclic thermal stress generated by long‐term use. © 2001 Scripta Technica, Electron Comm Jpn Pt 3, 84(10): 57–64, 2001