Adsorption Kinetics of Polyvinylpyrrolidone during Copper Electrodeposition
β Scribed by Willey, Mark J.; Reid, Jon; West, Alan C.
- Book ID
- 111688699
- Publisher
- The Electrochemical Society
- Year
- 2007
- Tongue
- English
- Weight
- 283 KB
- Volume
- 10
- Category
- Article
- ISSN
- 1099-0062
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Although previous works have shown the marked influence of thiourea as an organic additive in electrolyte bulk on copper electrodeposition, a variety of mechanisms could be responsible. The present paper concerns the effect of a thiourea layer adsorbed prior to copper electrodeposition. First eviden