𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Adhesion of aluminum films on polyimide by the electromagnetic tensile test

✍ Scribed by Bruno P. Baranski; Joseph H. Nevin


Book ID
112820849
Publisher
Springer US
Year
1987
Tongue
English
Weight
394 KB
Volume
16
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Effect of imidization temperature on the
✍ Jyongsik Jang; Jeung Hoon Lee πŸ“‚ Article πŸ“… 1996 πŸ› John Wiley and Sons 🌐 English βš– 995 KB

Peel strength and lap shear strength between aluminum and polyimide were measured at diff'erent imidization temperatures. Polyimide was synthesized from 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4'-diaminophenylether (ODA). T h e interfacial adhesion between polyimide and alumin