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Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

✍ Scribed by Bo-In Noh; Jeong-Won Yoon; Bo-Young Lee; Seung-Boo Jung


Book ID
106398268
Publisher
Springer US
Year
2008
Tongue
English
Weight
478 KB
Volume
20
Category
Article
ISSN
0957-4522

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