Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

✍ Scribed by Bo-In Noh; Jeong-Won Yoon; Bo-Young Lee; Seung-Boo Jung

• Book ID: 106398268
• Publisher: Springer US
• Year: 2008
• Tongue: English
• Weight: 478 KB
• Volume: 20
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/s10854-008-9811-1