✦ LIBER ✦
Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits
✍ Scribed by Bo-In Noh; Jeong-Won Yoon; Bo-Young Lee; Seung-Boo Jung
- Book ID
- 106398651
- Publisher
- Springer US
- Year
- 2010
- Tongue
- English
- Weight
- 675 KB
- Volume
- 22
- Category
- Article
- ISSN
- 0957-4522
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