Effect of plasma treatment on adhesion c
Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate
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Bo-In Noh; Chang-Sung Seok; Won-Chul Moon; Seung-Boo Jung
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Article
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2007
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Elsevier Science
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English
β 723 KB
The effects of plasma treatment on the surfaces of the flame resistant-4 (FR-4) and copper substrates are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angle, and atomic force microscopy (AFM). The adhesion strengths of the underfills/FR-4 substrate and underfills/copper s