Adhesion between viscoelastic and hard m
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N. A. Brunt
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Article
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1962
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John Wiley and Sons
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English
⚖ 640 KB
## Abstract The steady of peeling off process of a resin layer from a hard substrate can be considered as a rate process, being greatly dependent on temperature. Formulae relating the rate of release, the temperature, and the load with the energy of adhesion and the number of contact points between