𝔖 Bobbio Scriptorium
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Adhesion between viscoelastic and hard materials

✍ Scribed by N. A. Brunt

Publisher
John Wiley and Sons
Year
1962
Tongue
English
Weight
640 KB
Volume
6
Category
Article
ISSN
0021-8995

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✦ Synopsis

Abstract

The steady of peeling off process of a resin layer from a hard substrate can be considered as a rate process, being greatly dependent on temperature. Formulae relating the rate of release, the temperature, and the load with the energy of adhesion and the number of contact points between resin layer and substrate are derived. In the experimental part the energy of adhesion is measured according to these formulae for a number of different combinations of the same resin with glass, glass after removal of the water layers ordinarily adsorbed on a glass surface, and stainless steel. In all these cases there is but very little difference between the real energies of adhesion. Of more importance are time and temperature of the curing of the resin.

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