✦ LIBER ✦

Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

✍ Scribed by D. R. Flanders; E. G. Jacobs; R. F. Pinizzotto

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Copper substrate dissolution in eutectic

✍ S. Chada; R. A. Fournelle; W. Laub; D. Shangguan 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 478 KB

Characterization of the growth of interm

✍ S. Choi; T. R. Bieler; J. P. Lucas; K. N. Subramanian 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 291 KB

Growth of a Au-Ni-Sn intermetallic compo

✍ A. M. Minor; J. W. Morris 📂 Article 📅 2000 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 580 KB

Reaction diffusions of Cu6Sn5and Cu3Sn i

✍ Jeong -Won Yoon; Chang -Bae Lee; Dae -Up Kim; Seung -Boo Jung 📂 Article 📅 2003 🏛 TechnoPress 🌐 English ⚖ 624 KB

Influence of Dopant on Growth of Interme

✍ G. Y. Li; X. D. Bi; Q. Chen; X. Q. Shi 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 908 KB

Effect of soldering and aging time on in

✍ Won Kyoung Choi; Hyuck Mo Lee 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 474 KB