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Acoustooptical spectrometric control of process of plasmochemical etching of a masking photoresistive layer and silicon structures

โœ Scribed by F. L. Bizen; V. N. Zhogun; S. I. Zemtsovskii; V. I. Pustovoit; N. A. Ponomareva; I. M. Tirashkevich; A. V. Tyablikov; L. L. Pal'tsev


Publisher
Springer US
Year
1990
Tongue
English
Weight
336 KB
Volume
52
Category
Article
ISSN
0021-9037

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Silicon micromachining for MEMS components requires deep etching processes in combination with etch-resistant masks. The usual masking and lithographic procedures are expensive and unsuitable for fast layout changes. We developed a machining possibility, which combines the flexibility of laser direc