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Rapid prototyping of silicon microstructures by means of a new masking process and crystal orientation dependent etching

✍ Scribed by David Hilbig; Birgit Hannemann


Publisher
Elsevier Science
Year
2010
Tongue
English
Weight
689 KB
Volume
163
Category
Article
ISSN
0924-4247

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✦ Synopsis


Silicon micromachining for MEMS components requires deep etching processes in combination with etch-resistant masks. The usual masking and lithographic procedures are expensive and unsuitable for fast layout changes. We developed a machining possibility, which combines the flexibility of laser direct writing with the shape quality of crystal orientation dependent etching of silicon. The main step is substituting SiO 2 or Si 3 N 4 mask layers by etch-resistant metal films. These films can be directly patterned with a laser marking system followed by a well-known etch process in KOH.