[ACM Press the 50th Annual Design Automation Conference - Austin, Texas (2013.05.29-2013.06.07)] Proceedings of the 50th Annual Design Automation Conference on - DAC '13 - An accurate semi-analytical framework for full-chip TSV-induced stress modeling

✍ Scribed by Li, Yang; Pan, David Z.

• Book ID: 121289919
• Publisher: ACM Press
• Year: 2013
• Weight: 992 KB
• Category: Article
• ISBN: 1450320716
• DOI: 10.1145/2463209.2488957