[ACM Press the 50th Annual Design Automation Conference - Austin, Texas (2013.05.29-2013.06.07)] Proceedings of the 50th Annual Design Automation Conference on - DAC '13 - Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs

✍ Scribed by Song, Taigon; Liu, Chang; Peng, Yarui; Lim, Sung Kyu

• Book ID: 121289918
• Publisher: ACM Press
• Year: 2013
• Weight: 1010 KB
• Category: Article
• ISBN: 1450320716
• DOI: 10.1145/2463209.2488956