Acceleration of galvanic lead solder corrosion due to phosphate
โ Scribed by Caroline K. Nguyen; Brandi N. Clark; Kendall R. Stone; Marc A. Edwards
- Book ID
- 116385684
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 739 KB
- Volume
- 53
- Category
- Article
- ISSN
- 0010-938X
No coin nor oath required. For personal study only.
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Leaching of Ag, Cd, Cu, Pb, Sn, Sb and Zn from 50/50 Pb/Sn, 95/5 Sn/Sb and 96/4 Sn/Ag soldered copper plates into distilled, tap and well waters as a function of contact time under static conditions was done. Ag, Cd and Sb were not leached to significant extent. Significant amounts of tin were leach
It was previously reported that under certain conditions an electric current that transgresses the interface of a short carbon fiber (SCF)/polyetheretherketone (PEEK) composite vs. a X10CrNiMoTi1810 steel pairing causes extensive galvanic corrosion of the composite's short carbon fibers [1]. In orde