A Ka-band LTCC integrated 22-dBm MMIC po
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Dae Jun Kim; Kyung Sik Yoon; Chul Soon Park
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Article
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2003
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John Wiley and Sons
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English
⚖ 116 KB
## Abstract This paper describes the design and fabrication of a 0.7‐mm‐thick compact Ka‐band low‐temperature co‐fired ceramic (LTCC) power‐amplifier module, integrating the 0.25‐μm PHEMT MMIC power‐amplifier design. The LTCC module, designed for a surface‐mounting structure, and composed of a five