A transmission electron microscopy study has been made of the growth of nickel films electrodeposited from a Watts bath at a cd of 1 mA/cms on to vapour-deposited (100) copper films. Average film thicknesses in the range 75-250 A have been studied both in position on the substrate and as separate s
โฆ LIBER โฆ
A transmission electron microscopy study of intermetallic formation in aluminium-copper thin-film couples
โ Scribed by K. Rajan; E.R. Wallach
- Publisher
- Elsevier Science
- Year
- 1980
- Tongue
- English
- Weight
- 468 KB
- Volume
- 49
- Category
- Article
- ISSN
- 0022-0248
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## Abstract Formation of Ag~2~Te thin films from room temperature (300 K) solid state reaction of Ag and Te thin film couples is investigated. Rutherford Backscattering Spectrometry (RBS) studies confirmed the complete miscibility of the couples and the stoichiometry of the resulting Ag~2~Te. Struc