๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

A thermo-mechanical study on the electrical resistance of aluminum wire conductors

โœ Scribed by De-Shin Liu; Chin-Yu Ni

Book ID
108361889
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
368 KB
Volume
42
Category
Article
ISSN
0026-2714

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

A study on the electrical resistance of
A study on the electrical resistance of solder joint interconnections
โœ De-Shin Liu; Chin-Yu Ni ๐Ÿ“‚ Article ๐Ÿ“… 2002 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 722 KB

A BGA package warping produced hybrid deformations in the solder joint interconnections. This situation creates difficult challenges in avoiding certain mechanical failure problems and even maintaining acceptable electrical performance in the electronic package. Accessing electronic circuit simulati