𝔖 Bobbio Scriptorium

✦ LIBER ✦

A survey of chip joining techniques : L. F. Miller, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 60

Publisher: Elsevier Science
Year: 1970
Tongue: English
Weight: 92 KB
Volume: 9
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(70)90276-3

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Macro assembly-complex multi-chip LSI :

Macro assembly-complex multi-chip LSI : R. F. Bader, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 178

📂 Article 📅 1970 🏛 Elsevier Science 🌐 English ⚖ 103 KB

Flip-chip microcircuit bonding systems :

Flip-chip microcircuit bonding systems : T. R. Myers, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 131

📂 Article 📅 1970 🏛 Elsevier Science 🌐 English ⚖ 92 KB

Integrated aluminium connections : T. Ne

Integrated aluminium connections : T. Neuhuys, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 46

📂 Article 📅 1970 🏛 Elsevier Science 🌐 English ⚖ 99 KB

Parametric study of temperature distribu

Parametric study of temperature distributions in chips joined by controlled chip collapse techniques : S. Oktay, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 429

📂 Article 📅 1969 🏛 Elsevier Science 🌐 English ⚖ 97 KB

Improved tantalum chip capacitors for hy

Improved tantalum chip capacitors for hybrid circuits : D. E. Maguire, Proc. 1969 Electron. Compon. Conf., Washington, D.C. 30 April–2 May (1969), p. 211

📂 Article 📅 1969 🏛 Elsevier Science 🌐 English ⚖ 95 KB

Thick-film RF circuitry : P. J. Fosco, P

Thick-film RF circuitry : P. J. Fosco, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 289

📂 Article 📅 1970 🏛 Elsevier Science 🌐 English ⚖ 100 KB