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A study of transient processes in a closed vessel due to injection of hot liquid sprays

โœ Scribed by J. Valha; J.S. Lewis; J. Kubie

Book ID
108140848
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
350 KB
Volume
47
Category
Article
ISSN
0017-9310

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## Abstract At present, epoxy resin is applied during the manufacturing of more compact and thinner components for the packaging of electronic and other devices. Epoxy resin has superior properties in terms of heat resistance, insulation, and strength; however, defects such as deformations and crac