Analysis of stress due to shrinkage in a hardening process of liquid epoxy resin

✍ Scribed by Tetsuro Nishimura; Yasutada Nakagawa

• Publisher: John Wiley and Sons
• Year: 2002
• Tongue: English
• Weight: 215 KB
• Volume: 31
• Category: Article
• ISSN: 1099-2871
• DOI: 10.1002/htj.10028

✦ Synopsis

Abstract

At present, epoxy resin is applied during the manufacturing of more compact and thinner components for the packaging of electronic and other devices. Epoxy resin has superior properties in terms of heat resistance, insulation, and strength; however, defects such as deformations and cracks often occur because of stress concentration. It is important to determine the inner stress of resin solidification for molding processes. Through a combination of numerical analyses of heat generated due to chemical reactions and experiments on shrinkage and strain that occur during hardening of epoxy resin, it becomes possible to analyze the stress generated due to hardening shrinkage. The developed analytical method can contribute to the realization of highly reliable components made of epoxy resin. © 2002 Wiley Periodicals, Inc. Heat Trans Asian Res, 31(3): 194–211, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.10028