A study of high-temperature implantation of 72 keV copper ions into nickel

✍ Scribed by Wen-Fa Tsai; J.H. Liang; J.J. Kai; G.L. Kulcinski

• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 287 KB
• Volume: 228
• Category: Article
• ISSN: 0168-583X
• DOI: 10.1016/j.nimb.2004.10.038