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Effects of thermally-activated diffusion on 72 keV Ni ion implantation into Cu targets at elevated temperatures

✍ Scribed by W.F. Tsai; J.H. Liang; J.J. Kai


Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
132 KB
Volume
241
Category
Article
ISSN
0168-583X

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