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A study of electrically conductive adhesives as a manufacturing solder alternative

โœ Scribed by F. M. Coughlan; H. J. Lewis

Book ID
110627042
Publisher
Springer US
Year
2006
Tongue
English
Weight
402 KB
Volume
35
Category
Article
ISSN
0361-5235

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Electrical and mechanical characterizati
Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder
โœ Yong-Sung Eom; Keonsoo Jang; Jong-Tae Moon; Jae-Do Nam; Jong-Min Kim ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 282 KB

For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering th